Heat Bed Mini MOS Module

3D printer hot bed high-power expansion module, Mini appearance, compact design, with more powerful heating, to Solve the problem of current load due to excessive hot bed power, under normal heat dissipation, the module measured I (Max) = 30A can stand long-term work, please note that the current do not exceed 30A when using.

Characteristic:
1. Excellent MOS tube (nominal maximum current 280A).
2. Large heat sink, the maximum current can be up to 30A or more.
3. Can directly use the Ramp1.4 and MK S series motherboard hot bed output signal control.
4. Can use 5-24v digital signal control.
5. Only 39g.